スクリーンショット 2016-02-10 19.06.10

760 nm laser diode

Technology

  • DBR Single-Frequency Laser Chip
  • AlGaAs QW Active Layer
  • Facets passivated to withstand high powerwithout catastrophic optical damage (COD)
  • Epi designed for high reliability

Features

  • Wavelength tunable across several lines of the O2 spectrumaround 760nm
  • Pulsed operation for spectral stability at short pulse lengths
  • High power for CW applications
  • High Slope Efficiency
Absolute Maximum Rating

Parameter Symbol Unit Min Max
Storage Temperature TSTG °C 0 80
Operating  Temperature TOP °C 10.0 40
CW Laser Forward Current,T=25°C IF mA 120**
Laser Reverse Voltage VR V 0.0
Photodiode Forward Current 1/ IP mA 5.0
Photodiode Reverse Voltage 1/ VR V 20.0
Photodiode Dark Current, VR=10V, LD IF=0, 1/ ID nA 50
TEC Current 1/ ITEC A -2.0 2.0
TEC Voltage 1/ VTEC V -6.0 6.0
Thermistor Current 1/ ITHRM mA 1.0
Thermistor Voltage 1/ VTHRM V 10
Lead Soldering Temperature, 10 sec. Max. °C 260
**Do not exceed drive current or operating power of supplied LIV
CW Characteristics at TC = 25°C unless otherwise specified

Parameter Symbol Unit Min Typ Max
Center Wavelength @ 150mA λc nm 759 760 762
Optical Output Power @ 150mA Po mW See Power Options Call-out
Slope Efficiency ηd W/A 0.6 0.75
Threshold Current Ith mA 70 90
Laser Series Resistance RS Ω 2.0 2.5
Laser Forward Voltage @ 150mA VF V 2.0 2.5
Thermistor Resistance @ 25°C, 2/ RT 10
Photodiode Dark Current, VR=10V,
LD IF=0, 2/
ID nA 50
Laser Line Width @ 150mA ∆v MHz 0.7 1 10
Polarization Extinction Ratio, 1/ PER dB -16 -19
Beam Divergence @ FWHM θװ X θ º 6 X 26 8 X 30
Side Mode Suppression Ratio SMSR dB -30
Laser Polarization TE
Mode Structure Fundamental Mode
Handling Precautions

These devices are sensitive to ESD. When handling the module, grounded work area and wrist strap must be used. Always store in an antistatic container with all leads shorted together.

Package Type

CS / CM / T8

Minimum Power (mW)

40 / 80